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Dicing process Product List and Ranking from 6 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 08, 2025～Nov 04, 2025
This ranking is based on the number of page views on our site.

Dicing process Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 08, 2025～Nov 04, 2025
This ranking is based on the number of page views on our site.

  1. サンテック Tokyo//Electronic Components and Semiconductors
  2. null/null
  3. 多摩エレクトロニクス 本社 Tokyo//Manufacturing and processing contract
  4. 4 佐原テクノ工業 Chiba//others
  5. 5 豊和産業 Tokyo//Manufacturing and processing contract
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Dicing process Product ranking

Last Updated： Aggregation Period:Oct 08, 2025～Nov 04, 2025
This ranking is based on the number of page views on our site.

  1. Suntech Corporation Business Introduction サンテック
  2. Dicing process semiconductor processing business
  3. Tama Electronics Corporation Company Profile 多摩エレクトロニクス 本社
  4. 4 Dicing process 佐原テクノ工業
  5. 4 [Introduction to Processing Technology] Dicing Process シンコー

Dicing process Product List

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Dicing process

Dicing process

Dicing processing. From dicing to chip tray packing and appearance inspection.

Research and challenge even difficult processing! From dicing to chip tray packing and appearance inspection! Dicing processing by Sahara Techno Industry 【Features】 ○ Skilled in high-difficulty processing for ultra-slim chip ICs, compact ICs, and foreign matter countermeasure ICs ○ High-quality processing through step cutting ○ Chip tray packing using automatic sorting machines ○ High-reliability inspection using metal microscopes ○ Wafer sizes: 4 inches, 5 inches, 6 inches, 8 inches ● For more details, please contact us.

  • Other semiconductors

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[Introduction to Processing Technology] Dicing Process

[Introduction to Processing Technology] Dicing Process

Glass, ceramics, crystalline materials, various substrates, etc.! Leave contract processing and difficult machining to us!

We would like to introduce the dicing technology 'Dicing Processing' held by Shinko. Tape dicing achieves a reduction in scratches, dirt, and foreign material attachment, as well as cost reduction. Additionally, we can perform alignment cutting using various software, suppress and remove burrs (plating and metallization), and support high-pressure nozzles and two-fluid spin cleaning machines. We respond to customer needs with reliable quality from small-scale prototypes to mass production. 【Features】 ■ Tape Dicing: Reduction of scratches, dirt, and foreign material attachment, cost reduction ■ Square Chuck Table: Supports large substrates and reduces costs through multi-layer processing ■ Alignment cutting using various software ■ Suppression and removal of burrs (plating and metallization) ■ Capable of cutting and grooving thick materials (up to t10mm) ■ Compatible with high-pressure nozzles and two-fluid spin cleaning machines *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Contract manufacturing

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Dicing process

Dicing process

Dicing process

Our company handles processing not only of Si wafers but also of glass, ceramics, single crystal materials, and resins. Cutting water can be compatible with pure water. We can accommodate everything from prototype processing to mass production. Additionally, we can support cutting methods tailored to your applications (such as scribing), so please feel free to consult with us.

  • Other semiconductors
  • Processing Contract
  • others

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Dicing process

Dicing process

Use of a dicing device equipped with a rotating blade.

To accurately cut and chip the circuits formed on Si wafers, a technique called dicing is used. It is common to use a dicing device equipped with a rotating blade. At Toyowa Industry Co., Ltd., we handle processing not only for Si wafers but also for glass, ceramics, single crystal materials, resins, and more. Cutting water can be compatible with pure water. We support everything from prototype processing to mass production. Additionally, we can accommodate cutting methods tailored to your needs (such as scribing). For more details, please contact us or refer to our catalog.

  • Surface treatment contract service
  • Processing Contract

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Memus Core - Latest Dicing Processing for MEMS

Memus Core - Latest Dicing Processing for MEMS

We are advancing the development and commercialization of new generation MEMS products.

In stealth dicing processing technology, MEMS wafers and LSI wafers can be divided into chips without "cutting lines" and through a "dry process," which is expected to yield significant benefits not found in conventional dicing methods. Especially in the development of MEMS devices with fragile structures, we recommend utilizing this technology from the design, prototyping, and development stages.

  • Contract manufacturing

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Suntech Corporation Business Introduction

Suntech Corporation Business Introduction

We will cut the IC chips smaller, thinner, and process them with greater precision.

Suntech Co., Ltd. provides cutting (dicing) and grinding (thinning) processing technologies primarily for semiconductor silicon wafers. Additionally, these processing technologies are applied to various materials that are considered difficult to process, such as blue glass, ceramics, and solder sheets. We utilize technologies such as back grinding (grinding and polishing), dicing, chip tray technology, and visual inspection technology. Furthermore, Suntech's prototype technology support division offers clean rooms and processing equipment. For more details, please contact us or refer to our catalog.

  • Other semiconductors
  • Processing Contract
  • Glass

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Tama Electronics Corporation Company Profile

Tama Electronics Corporation Company Profile

Based on abundant experience and achievements, we provide production solutions for electronic components.

Tama Electronics Co., Ltd. started in 1979 as a production base for the Oki Electric Semiconductor Group, beginning with testing services. Since then, we have continuously expanded our business fields, including chip processing, memory final testing, and WCSP product assembly, accumulating numerous production achievements and advanced technology and know-how. To flexibly respond to the increasingly sophisticated and diverse needs of our customers, we prioritize "quality," "cost," and "speed" in all aspects and continually strive to improve our knowledge and skills. 【Business Activities】 ■ Dicing processing (silicon/glass/ceramic/quartz/other composite materials) ■ Vapor deposition, thin film, and film processing; design, manufacturing, and sales of optical filters such as IR cut filters and BAG filters ■ Taping services (tape reel storage) ■ Packaging format changes (tray ⇔ tape reel/stick ⇔ tape reel/split packaging, etc.) ■ Visual inspection (integrated circuits/optical filters/other electronic components) ■ Contract manufacturing of equipment *For more details, please refer to the PDF materials or feel free to contact us.

  • Processing Contract

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